Huawei Claims It Will Make Cutting-Edge Semiconductors By 2031

The company said its next-generation chips will be “viable and affordable.”

Huawei has made a bold claim that it can manufacture its own semiconductor chips that are as good as the competition thanks to a new breakthrough. At a semiconductor symposium in Shanghai, the Chinese company said it would be able to produce chips with transistor density that can match the 1.4-nanometer processes that are expected to be used by competitors such as Taiwan Semiconductor Manufacturing Corp (TSMC), Samsung and others.

If achieved, this development would be a big deal for Huawei as it has been facing continuously expanding US trade sanctions since 2019. The restrictions have set Huawei behind the competition, as it is not allowed access to the specialized equipment that other companies are using to achieve that 1.4nm level. TSMC, on the other hand, revealed its 1.4nm process which will enter production in 2028.

While Huawei will be five years behind the leading company, it can offer more cost-effective solutions. He Tingbo, head of Huawei’s chip department, said its process is “feasible and economical.” wall street journal. Currently, China’s largest semiconductor maker, Semiconductor Manufacturing International Corp. offers chips with 7nm processors, which can be seen in Huawei’s Mate 60 smartphone.



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